Lead frame and flip chip package device thereof

摘要

The present invention relates to the field of semiconductor chip packages, and more specifically to a lead frame and flip chip package device thereof. In one embodiment, a lead frame for electrically connecting a chip to outside leads, can include a plurality of lead fingers, where each of the plurality of lead fingers comprises a plurality of outburst regions extending from an edge thereof. In one embodiment, a flip chip package device can include: a chip and a plurality of solder bumps, where one surface of the chip is connected to a first surface of each of the plurality of solder bumps; and the lead frame, where second surfaces of each of the plurality solder bumps are connected with corresponding outburst regions of the lead frame to connect the chip to the lead frame through the solder bumps.

主权项

1. A lead frame for electrically connecting a chip to outside leads, the lead frame comprising:
a) a plurality of lead fingers; and b) wherein each of said plurality of lead fingers comprises a plurality of outburst regions extending from an edge thereof, and a remaining part; and c) wherein upper surfaces of each of said plurality of outburst regions connected to said chip are in a level lower than upper surfaces of each said remaining part of said lead fingers.