| 发明名称 | Precision spacing for stacked wafer assemblies | ||
| 摘要 | An assembly including a first wafer, a second wafer, a spacing wafer configured to be positioned between the first wafer and the second wafer, and a plurality of spacing elements configured to be positioned within the spacing wafer and to contact the first wafer and the second wafer, the spacing elements sized to define a first spacing distance between the first wafer and the second wafer. | ||
| 申请公布号 | US8834988(B2) | 申请公布日期 | 2014.09.16 |
| 申请号 | US201113262089 | 申请日期 | 2011.04.21 |
| 申请人 | Empire Technology Development LLC | 发明人 | Margalit Mordehai |
| 分类号 | B32B3/22;B32B38/10;H01L27/146;G02B3/00;G02B13/00;H01L31/0232 | 主分类号 | B32B3/22 |
| 代理机构 | Pepper Hamilton LLP | 代理人 | Pepper Hamilton LLP |
| 主权项 | 1. An assembly comprising: a first wafer; a second wafer; a spacing wafer configured to be positioned between the first wafer and the second wafer; and a plurality of removable and reusable spacing elements configured to be positioned within the spacing wafer and to contact the first wafer and the second wafer, the removable and reusable spacing elements sized to define a first spacing distance between the first wafer and the second wafer. | ||
| 地址 | Wilmington DE US | ||