发明名称 |
Dynamically tracking spectrum features for endpoint detection |
摘要 |
A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined. |
申请公布号 |
US8834229(B2) |
申请公布日期 |
2014.09.16 |
申请号 |
US201113090926 |
申请日期 |
2011.04.20 |
申请人 |
Applied Materials, Inc. |
发明人 |
David Jeffrey Drue;Lee Harry Q. |
分类号 |
B24B49/00;G01B11/06 |
主分类号 |
B24B49/00 |
代理机构 |
Fish & Richardson P.C. |
代理人 |
Fish & Richardson P.C. |
主权项 |
1. A method of controlling polishing, comprising:
polishing a substrate; receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing; measuring a sequence of spectra of light from the substrate while the substrate is being polished; generating a sequence of values of the characteristic of the selected spectral feature from the sequence of spectra, the generating including for at least some spectra from the sequence of spectra, generating a modified wavelength range based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, searching the modified wavelength range for the selected spectral feature, and determining a value of the characteristic of the selected spectral feature; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. |
地址 |
Santa Clara CA US |