发明名称 Dynamically tracking spectrum features for endpoint detection
摘要 A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
申请公布号 US8834229(B2) 申请公布日期 2014.09.16
申请号 US201113090926 申请日期 2011.04.20
申请人 Applied Materials, Inc. 发明人 David Jeffrey Drue;Lee Harry Q.
分类号 B24B49/00;G01B11/06 主分类号 B24B49/00
代理机构 Fish & Richardson P.C. 代理人 Fish & Richardson P.C.
主权项 1. A method of controlling polishing, comprising: polishing a substrate; receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing; measuring a sequence of spectra of light from the substrate while the substrate is being polished; generating a sequence of values of the characteristic of the selected spectral feature from the sequence of spectra, the generating including for at least some spectra from the sequence of spectra, generating a modified wavelength range based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, searching the modified wavelength range for the selected spectral feature, and determining a value of the characteristic of the selected spectral feature; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
地址 Santa Clara CA US