| 摘要 |
The present invention relates to a semiconductor package using one layer lead frame substrate and a method for fabricating the same, more particularly, to a semiconductor package using one layer lead frame substrate and a method for fabricating the same having a structure that may maximize effects of thermal emission. That is, the present invention provides a semiconductor package using one layer lead frame substrate and a method for fabricating the same that may maximize effects of thermal emission by fabricating, using a metal plate having a predetermined area, the one layer lead frame substrate including a plurality of lead frame circuit patterns formed of a copper material and a resin layer, which is filled between each lead frame circuit pattern to integrally support the circuit patterns, and then, without discarding the metal plate, bonding the metal plate to a lower surface of the semiconductor package to form an integral structure to emit heat. |
