| 摘要 |
<p>The present invention relates to a semiconductor device for fingerprint recognition and a method for manufacturing the same and more specifically, to a semiconductor device for fingerprint recognition in a new structure using a through mold via to be stronger than an existing semiconductor device while having mass-productivity, and a method for manufacturing the same. The present invention provides the semiconductor device for fingerprint recognition and the method for manufacturing the same which comprise: a semiconductor chip for a fingerprint sensor; a substrate to which the semiconductor chip for a fingerprint sensor is attached; a conductive wire connected between a bonding pad of the semiconductor chip and a first conductive pattern of the substrate; and a molding compound resin which molds and seals the lower part of the semiconductor chip and the conductive wire except for a fingerprint sensing part formed on the upper surface of the semiconductor chip. The semiconductor device for fingerprint recognition is characterized by comprising: a pre-solder ball fused on a second conductive pattern of the substrate; a through mold via passing through from the upper surface of the molding compound resin to the upper part of the pre-solder ball; and conductive materials filled in the through mold via to be electrically connected to the pre-solder ball, and coated over the surface of the molding compound resin around the through mold via.</p> |
