STAGE BLOCK FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a stage block to manufacture a semiconductor package and a method to attach a semiconductor chip using the same and, more specifically, to a stage block to manufacture a semiconductor package and a method to attach a semiconductor chip using the same capable of stably making preheating and chip attachment processes for a strip substrate during a bonding process of a thermal compression type. The present invention provides the stage block to manufacture the semiconductor package and the method to attach the semiconductor chip using the same capable of stably performing the preheating and chip attachment processes for the strip substrate including multiple units since the semiconductor chip is attached as half unit the units of the strip substrate is heated by a first heater and a first heating section and the semiconductor chip is attached as the rest of the units is heated by a second heater and a second heating section after a heater placed in a lower part of a stage plate of the stage block is divided into the first and second heaters while a heating section of the stage plate is divided into the first and second heating sections.