发明名称 SUBSTRATE PROCESSING METHOD
摘要 Provided is a substrate processing method which prevents the electrification of a substrate which has a surface with a structure. A substrate processing method includes rotating a substrate around the center axis of the substrate, starting the irradiation of a soft X-ray to the surface of the substrate, starting the supply of deionized water to the surface of the substrate when or after starting the irradiation of the soft X-ray, stopping the supply of deionized water to the surface of the substrate, and then stopping the irradiation of the soft X-ray to the surface of the substrate. While supplying the deionized water to the surface of the substrate, the soft X-ray is always radiated to the surface of the substrate, thereby preventing the electrification of a structure formed on the surface of the substrate.
申请公布号 KR20140109299(A) 申请公布日期 2014.09.15
申请号 KR20140024083 申请日期 2014.02.28
申请人 EBARA CORPORATION 发明人 ISHIBASHI TOMOATSU
分类号 H01L21/304;H01L21/302 主分类号 H01L21/304
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