GRANULAR EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR DEVICE USING THE SAME AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

DISCLOSED IS A GRANULAR EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR USED FOR A SEMICONDUCTOR DEVICE OBTAINED BY ENCAPSULATING A SEMICONDUCTOR ELEMENT (401) BY COMPRESSION MOLDING, WHEREIN, IN THE PARTICLE SIZE DISTRIBUTION AS DETERMINED BY SIEVING THE WHOLE EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR USING JIS STANDARD SIEVES, THE RATIO OF PARTICLES HAVING A SIZE OF 2 MM OR GREATER IS NOT MORE THAN 3% BY MASS, THE RATIO OF PARTICLES HAVING A SIZE OF 1 MM OR GREATER, BUT LESS THAN 2 MM IS FROM 0.5% BY MASS OR MORE TO 60% BY MASS OR LESS, AND THE RATIO OF MICROFINE PARTICLES HAVING A SIZE OF LESS THAN 106 µm IS NOT MORE THAN 5% BY MASS. (FIGURE 10)