| 摘要 |
The present invention relates to a supporting device for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same and, more specifically, a supporting device to prevent the warpage of an interposer when a semiconductor package, in which a semiconductor chip is connected to a substrate through the interposer to be conductive, is manufactured and a method for manufacturing a semiconductor package using the same. The present invention forms a supporting stiffener on a predetermined area of a carrier and makes an edge part of the interposer be supported to the supporting stiffener. Therefore, the present invention prevents a non-wet state and excessive compressive strain of a conductive connector due to the warpage of the interposer by adopting a reflow method for attaching an upper chip to the interposer to be conductive. |
