SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF ESTIMATING SURFACE TEMPERATURE OF THE SAME

摘要

Provided are a semiconductor package and a method of estimating the surface temperature of a semiconductor device including the same. The semiconductor package includes a first package which includes a first substrate having a first semiconductor chip; a second package which faces the first package, is separated from the first package, and includes a second substrate having a second semiconductor chip; a connection structure connects the first package and the second package; a first temperature sensor connected to the first substrate; a second temperature sensor connected to the first semiconductor chip; and a third temperature sensor connected to the second semiconductor chip.