发明名称 LIGHT EMITTING DEVICE PACKAGE AND PACKAGE SUBSTRATE
摘要 According to an embodiment of the present invention, a light emitting device package includes: a light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode and a second electrode which are connected to the first conductive semiconductor layer and the second conductive semiconductor layer, respectively; and a support structure which supports the light emitting structure and includes a first support electrode connected electrically with the first electrode, and a second support electrode connected electrically with the second electrode. An area of the support structure on a surface where the light emitting structure is supported by the support structure is smaller than an area of the light emitting structure.
申请公布号 KR20140108983(A) 申请公布日期 2014.09.15
申请号 KR20130023003 申请日期 2013.03.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 IM, SUNG JUN;CHO, DONG HYUN;SOHN, JONG RAK;KWON, YONG MIN
分类号 H01L33/36;H01L33/20;H01L33/62 主分类号 H01L33/36
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