发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND PACKAGE SUBSTRATE |
摘要 |
According to an embodiment of the present invention, a light emitting device package includes: a light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode and a second electrode which are connected to the first conductive semiconductor layer and the second conductive semiconductor layer, respectively; and a support structure which supports the light emitting structure and includes a first support electrode connected electrically with the first electrode, and a second support electrode connected electrically with the second electrode. An area of the support structure on a surface where the light emitting structure is supported by the support structure is smaller than an area of the light emitting structure. |
申请公布号 |
KR20140108983(A) |
申请公布日期 |
2014.09.15 |
申请号 |
KR20130023003 |
申请日期 |
2013.03.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
IM, SUNG JUN;CHO, DONG HYUN;SOHN, JONG RAK;KWON, YONG MIN |
分类号 |
H01L33/36;H01L33/20;H01L33/62 |
主分类号 |
H01L33/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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