发明名称 HIGH SPEED PRINTED CIRCUIT BOARD WITH UNIFORM VIA INSIDE DIAMETER
摘要 A printed circuit board, and method of manufacture, for high speed signals. The printed circuit board has small diameter vias of uniform inside diameter when plated. The uniformity of the inside diameter, at least over the region in which a press fit segment is inserted, is sufficient to make a reliable electrical and mechanical connection to the press fit segment with reduced risk of damage to the press fit segment.
申请公布号 WO2014138024(A1) 申请公布日期 2014.09.12
申请号 WO2014US20220 申请日期 2014.03.04
申请人 AMPHENOL CORPORATION 发明人 HARKNESS, ARTHUR, E., JR.;SAMSON, RALPH, L.;REED, DONALD, R.
分类号 H05K3/40;H05K3/46 主分类号 H05K3/40
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