HEAT-DISSIPATING SUBSTRATE AND METHOD FOR PRODUCING SAME

摘要

This heat-dissipating substrate (1) comprises: an insulating layer (4) made of an insulating resin material; an electroconductive layer (5) made of an electroconductive material; a substrate body (2) including said insulating layer (4) and said electroconductive layer (5); a through hole (6) that penetrates said substrate body (2); a heat-dissipating body (3) that is made of a heat-transferring material and that is housed inside said through hole (6); and a plating part (8) formed by executing a plating treatment in a state where said heat-dissipating body (3) is arranged inside said through hole (6). The plating part (8) is interposed between said heat-dissipating body (3) and said through hole (6), holds said heat-dissipating body (3) inside said through hole (6), and covers the entire surface of said heat-dissipating body (3).