INTERPOSER, METHOD FOR MANUFACTURING THE SAME, 3-DIMENSIONAL INTEGRATED CIRCUIT, 3-DIMENSIONAL INTEGRATED CIRCUIT CHIP PACKAGE

摘要

Disclosed is an interposer. The interposer includes an interposer substrate, a re-wiring layer, at least one TSV, at least one temperature measurement unit, and at least one first metal. The re-wiring layer is disposed on the interposer substrate. The at least one TSV passes through the interposer substrate and the re-wiring layer vertically. The at least one temperature measurement unit includes at least one second metal which is in contact with the interposer substrate within the re-wiring layer among an area over the interposer substrate and the re-wiring layer and transmits an electrical signal corresponding to the temperature of the interposer substrate to the outside of the temperature measurement unit. The first metal is in contact with the interposer substrate within the re-wiring layer and transmits the electrical signal of the second metal to the TSV by being electrically connected to the second metal and the TSV.