发明名称 PRESSURIZING APPARATUS, SUBSTRATE BONDING APPARATUS, AND BONDED SUBSTRATES
摘要 <p>Moving the substrates quickly, as well as applying a large pressure to the substrates are required. A pressing apparatus for pressing a plurality of substrates stacked on one another, includes: a first stage that supports the plurality of substrates; a second stage that can sandwich the plurality of substrates between the first stage and the second stage; a driving section that moves the first stage towards the second stage so as to sandwich the plurality of substrates; and a pressing section that, when the driving section has made the first stage reach a predetermined position, applies a pressing force to the first stage to press the plurality of substrates between the first stage and the second stage, where the driving section and the pressing section are arranged next to each other so that at least part of the driving section and the pressing section overlaps in the moving direction.</p>
申请公布号 KR20140108677(A) 申请公布日期 2014.09.12
申请号 KR20147018906 申请日期 2012.12.07
申请人 NIKON CORPORATION 发明人 IZUMI SHIGETO;TAKAHASHI SATOSHI
分类号 H01L21/603;H01L21/02;H01L21/683 主分类号 H01L21/603
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