ADHESIVE FILM, ADHESIVE FILM INTEGRATED WITH DICING SHEET, ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE, ADHESIVE FILM INTEGRATED WITH BACK GRIND TAPE CUM DICING SHEET, LAMINATE, CURED PRODUCT OF LAMINATE, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to provide an adhesive film (10) which exhibits sufficient transparency and ensures high reliability of solder joints. The present invention is an adhesive film (10) which is for use in inter-terminal connection and which is to be interposed between an electronic component (20) having multiple first terminals (21) on the surface and a circuit component (30) having multiple second terminals (31) corresponding to the first terminals (21), the first terminals (21) being to be electrically connected to the second terminals (31), wherein: each first terminal (21) has a width of 3 to 100μm, and bears a low-melting metal composition part that covers at least a part of the surface thereof so as to satisfy the requirements 0.6