发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 A substrate processing device (1) according to an embodiment comprises: a table (4) which supports a substrate (W); a solvent supply unit (8) for supplying the surface of a substrate (W) on the table (4) with a volatile solvent; and an irradiation unit (10) which functions as a heater for heating the substrate (W) to change the volatile solvent into liquid droplets with an air layer generated on the surface of the substrate (W) supplied with the volatile solvent by irradiating the substrate (W) supplied with the volatile solvent with light. Thereby, it is possible to favorably dry a substrate while suppressing the collapse of a pattern.
申请公布号 WO2014136670(A1) 申请公布日期 2014.09.12
申请号 WO2014JP55054 申请日期 2014.02.28
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 MIYAZAKI KUNIHIRO;HAYASHI KONOSUKE;OOTAGAKI TAKASHI;NAGASHIMA YUJI
分类号 H01L21/304;F26B3/28;F26B5/16 主分类号 H01L21/304
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