STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A stacked device encompasses a lower chip including a plurality of wiring lands and a plurality of wall-block patterns, each of the wall-block patterns is allocated at a position except locations where the wiring lands are disposed, each of the wall-block patterns has a inclined plane, a height of each of the wall-block patterns measured from a reference plane of the array of the wiring lands is higher than the wiring lands, and an upper chip including a plurality of wiring bumps assigned correspondingly to the positions of the wiring lands, respectively, and a plurality of cone bumps assigned correspondingly to the positions of the wall-block patterns, respectively.

主权项

1. A stacked device comprising:
a lower chip including a plurality of wiring lands and a plurality of wall-block patterns, each of the wall-block patterns is allocated at a position except locations where the wiring lands are disposed, each of the wall-block patterns has a inclined plane, a height of each of the wall-block patterns measured from a reference plane of an array of the plurality of the wiring lands is equal or higher than the wiring lands; and an upper chip including a plurality of wiring bumps assigned correspondingly to the positions of the wiring lands, respectively, and a plurality of cone bumps assigned correspondingly to the positions of the wall-block patterns, respectively.