发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate.
申请公布号 US2014251539(A1) 申请公布日期 2014.09.11
申请号 US201414198922 申请日期 2014.03.06
申请人 Tokyo Electron Limited 发明人 Mizuno Tsuyoshi;Tokunaga Yoichi;Namba Hiromitsu;Ueki Tatuhiro;Nogami Jun;Higashijima Jiro;Amano Yoshifumi;Miyama Takatoshi
分类号 H01L21/67 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate processing apparatus that supplies a processing liquid to a rotating substrate to process the substrate, comprising: a substrate rotating unit configured to rotate the substrate, a processing liquid supply unit configured to supply the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit provided at an outside of the opening, and configured to generate a negative pressure which acts toward the outside of the substrate.
地址 Tokyo JP