发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate. |
申请公布号 |
US2014251539(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201414198922 |
申请日期 |
2014.03.06 |
申请人 |
Tokyo Electron Limited |
发明人 |
Mizuno Tsuyoshi;Tokunaga Yoichi;Namba Hiromitsu;Ueki Tatuhiro;Nogami Jun;Higashijima Jiro;Amano Yoshifumi;Miyama Takatoshi |
分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
1. A substrate processing apparatus that supplies a processing liquid to a rotating substrate to process the substrate, comprising:
a substrate rotating unit configured to rotate the substrate, a processing liquid supply unit configured to supply the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit provided at an outside of the opening, and configured to generate a negative pressure which acts toward the outside of the substrate. |
地址 |
Tokyo JP |