发明名称 SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF
摘要 A solar cell module in the present invention includes: a wiring member electrically connecting solar cell elements to each other; and a structure in which a solder bonding portion is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder, a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and a side surface of the solder bonding portion and a side surface of the wiring member are covered with a thermosetting resin.
申请公布号 US2014251409(A1) 申请公布日期 2014.09.11
申请号 US201214352114 申请日期 2012.10.17
申请人 Mitsubishi Electric Corporation 发明人 Hamaguchi Tsuneo;Yabugaki Yoshimi;Echizenya Daisuke;Fujita Jun;Takayama Tomoo;Miyamoto Shinsuke
分类号 H01L31/05;H01L31/048 主分类号 H01L31/05
代理机构 代理人
主权项 1. A solar cell module comprising: a wiring member that electrically connects a plurality of solar cell elements to each other; a solder bonding portion that is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder; and a thermosetting resin that covers a side surface of the solder bonding portion, wherein a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and the solder spreads to a side surface of the collecting electrode, and 1a side surface of the wiring member is covered with the thermosetting resin.
地址 Tokyo JP