发明名称 |
SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF |
摘要 |
A solar cell module in the present invention includes: a wiring member electrically connecting solar cell elements to each other; and a structure in which a solder bonding portion is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder, a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and a side surface of the solder bonding portion and a side surface of the wiring member are covered with a thermosetting resin. |
申请公布号 |
US2014251409(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201214352114 |
申请日期 |
2012.10.17 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
Hamaguchi Tsuneo;Yabugaki Yoshimi;Echizenya Daisuke;Fujita Jun;Takayama Tomoo;Miyamoto Shinsuke |
分类号 |
H01L31/05;H01L31/048 |
主分类号 |
H01L31/05 |
代理机构 |
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代理人 |
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主权项 |
1. A solar cell module comprising:
a wiring member that electrically connects a plurality of solar cell elements to each other; a solder bonding portion that is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder; and a thermosetting resin that covers a side surface of the solder bonding portion, wherein a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and the solder spreads to a side surface of the collecting electrode, and 1a side surface of the wiring member is covered with the thermosetting resin. |
地址 |
Tokyo JP |