| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which an image sensor element can be stably mounted on a mount surface.SOLUTION: A wiring board 10 includes an insulating layer 1 formed of a resin-based insulating material comprising a thermosetting resin component and a wiring conductor 2 formed of a metal foil, alternately layered into plurality of layers, in which the wiring conductors 2 located to sandwich the insulating layer 1 in a vertical direction are connected to a penetrating conductor 3 formed of a cured product of a conductive paste that fills a through-hole 1a penetrating the insulating layer 1; and the wiring board has a rectangular mount surface 10a where an image sensor element E is to be mounted on an upper surface of the board. The wiring conductor 2 in the uppermost layer has a lower arrangement density in a region corresponding to the center portion in the longitudinal direction of the mount surface 10a than an arrangement density in a region corresponding to both end portions in the longitudinal direction of the mount surface 10a; and the thermosetting resin component in the insulating layer 1 of the uppermost layer intrudes into a space between side faces of the wiring conductor 2 in the uppermost layer to give a concave surface profile to the mount surface 10a. |
