| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor laser capable of improving luminous efficiency and suppressing heat generation while securing mechanical strength and preventing breakage in a manufacturing step or in use.SOLUTION: The process of manufacturing the semiconductor laser includes: producing a wafer substrate formed by laminating a plurality of layer structures of a semiconductor laser by repeating a plurality of times steps of pasting a wafer substrate from which semiconductor laser bars are cut onto a glass plate and thinning it while keeping strength, laminating the thinned wafer substrate, and peeling the wafer substrate from the glass plate; and cutting a laminated semiconductor laser bar formed by laminating a plurality of thinned semiconductor laser bars from the wafer substrate. |
