| 发明名称 |
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH A GOLD INTERFACE LAYER |
| 摘要 |
Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon. |
| 申请公布号 |
US2014252586(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201414287141 |
申请日期 |
2014.05.26 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
JANG JIN-WOOK;MAHALINGAM LALGUDI M.;SANCHEZ AUDEL A.;VISWANATHAN LAKSHMINARAYAN |
| 分类号 |
H01L23/373;H01L23/00 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a primary portion of a substrate; a die; and a die attach layer between the die and the primary portion of the substrate, the die attach layer comprising a gold interface layer that includes gold and a plurality of first precipitates in the gold, wherein each of the first precipitates comprises a combination of nickel, cobalt, palladium, gold, and silicon. |
| 地址 |
Austin TX US |
