发明名称 Image Sensor with Improved Dark Current Performance
摘要 Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate having a first side and a second side opposite the first side. The semiconductor substrate contains a radiation-sensing region configured to sense radiation projected toward the substrate from the second side. A first layer is disposed over the second side of the semiconductor substrate. The first layer has a first energy band gap. A second layer is disposed over the first layer. The second layer has a second energy band gap. A third layer is disposed over the second layer. The third layer has a third energy band gap. The second energy band gap is smaller than the first energy band gap and the third energy band gap.
申请公布号 US2014252521(A1) 申请公布日期 2014.09.11
申请号 US201314030073 申请日期 2013.09.18
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Kao Min-Feng;Yaung Dun-Nian;Liu Jen-Cheng;Hung Feng-Chi;Tsai Shuang-Ji;Lin Jeng-Shyan;Chuang Chun-Chieh
分类号 H01L31/0216 主分类号 H01L31/0216
代理机构 代理人
主权项 1. A semiconductor image sensor device, comprising: a semiconductor substrate having a first side and a second side opposite the first side, wherein the semiconductor substrate contains a radiation-sensing region configured to sense radiation projected toward the substrate from the second side; a first layer disposed over the second side of the semiconductor substrate, the first layer having a first energy band gap; a second layer disposed over the first layer, the second layer having a second energy band gap; and a third layer disposed over the second layer, the third layer having a third energy band gap; wherein the second energy band gap is smaller than the first energy band gap and the third energy band gap.
地址 Hsin-Chu TW