发明名称 |
Image Sensor with Improved Dark Current Performance |
摘要 |
Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate having a first side and a second side opposite the first side. The semiconductor substrate contains a radiation-sensing region configured to sense radiation projected toward the substrate from the second side. A first layer is disposed over the second side of the semiconductor substrate. The first layer has a first energy band gap. A second layer is disposed over the first layer. The second layer has a second energy band gap. A third layer is disposed over the second layer. The third layer has a third energy band gap. The second energy band gap is smaller than the first energy band gap and the third energy band gap. |
申请公布号 |
US2014252521(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201314030073 |
申请日期 |
2013.09.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Kao Min-Feng;Yaung Dun-Nian;Liu Jen-Cheng;Hung Feng-Chi;Tsai Shuang-Ji;Lin Jeng-Shyan;Chuang Chun-Chieh |
分类号 |
H01L31/0216 |
主分类号 |
H01L31/0216 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor image sensor device, comprising:
a semiconductor substrate having a first side and a second side opposite the first side, wherein the semiconductor substrate contains a radiation-sensing region configured to sense radiation projected toward the substrate from the second side; a first layer disposed over the second side of the semiconductor substrate, the first layer having a first energy band gap; a second layer disposed over the first layer, the second layer having a second energy band gap; and a third layer disposed over the second layer, the third layer having a third energy band gap; wherein the second energy band gap is smaller than the first energy band gap and the third energy band gap. |
地址 |
Hsin-Chu TW |