发明名称 MEMS APPARATUS
摘要 A MEMS apparatus includes a pillar, a supporter, and a solder. The pillar has a first side and a second side opposite to the first side. The supporter supports the pillar. The supporter is adjacent to the pillar, but the supporter is not connected to the pillar. The supporter has a third side and a fourth side opposite to the third side. The supporter includes a plurality of first confined layers and a plurality of second confined layers. These first confined layers and these second confined layers are overlapped with each other. The second side and the third side are adjacent to each other. The solder is located between the second side and the third side. The solder is also located at the first side and the fourth side. The solder is utilized to combine the pillar and the supporter. The solder also isolates the pillar and the supporter.
申请公布号 US2014252511(A1) 申请公布日期 2014.09.11
申请号 US201414200804 申请日期 2014.03.07
申请人 SenseTech Co., Ltd 发明人 LIU Mao-Chen;LU Po-Wei;CHOU Wen-Chieh;WENG Shu-Yi;WANG Chun-Chieh
分类号 B81B3/00 主分类号 B81B3/00
代理机构 代理人
主权项 1. A micro-electromechanical system (MEMS) apparatus, comprising: a pillar, having a first side and a second side opposite to the first side; a supporter, having a third side and a fourth side opposite to the third side adjacent to the second side, comprising a plurality of first binding layers and a plurality of second binding layers respectively overlapping the first binding layers, and configured to support the pillar which is adjacent to but does not connect to the supporter; and a solder, located between the second side and the third side and between the first side and the fourth side, and configured to contact with and separate the pillar and the supporter.
地址 Taipei City TW
您可能感兴趣的专利