AUTOMATIC MANUFACTURING PROCESS FOR PROVIDING BUFFER PADS FOR A PCB AND PCB STRUCTURE USING THE SAME

摘要

An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d) providing a pick-and-place machine and the buffer pads (40); e) using the pick-and-place machine to place the buffer pads (40) on the buffer zone (12) moistened with the adhesive (30); and f) curing the adhesive (30) to attach the buffer pads (40) to the PCB (10). Thus, labor is saved and manufacturing time is reduced.

主权项

1. An automatic manufacturing process for providing buffer pads for a print circuit board, comprising:
a) providing the print circuit board; b) providing an automatic dispensing device and an adhesive; c) using the automatic dispensing device to dispense the adhesive to a buffer zone on the print circuit board; d) providing a pick-and-place machine and the buffer pads; e) using the pick-and-place machine to place the buffer pads on the buffer zone moistened with the adhesive; and f) curing the adhesive to attach the buffer pads to the print circuit board.