| 发明名称 |
Package-on-Package Structure and Methods for Forming the Same |
| 摘要 |
A method includes coining solder balls of a bottom package, wherein top surfaces of the solder balls are flattened after the step of coining. The solder balls are molded in a molding material. The top surfaces of the solder balls are through trenches in the molding material. |
| 申请公布号 |
US2014252609(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201313874821 |
申请日期 |
2013.05.01 |
| 申请人 |
Semiconductor Manufacturing Company, Ltd. Taiwan |
发明人 |
Lee Chien-Hsun;Cheng Jung Wei;Hou Hao-Cheng;Wang Tsung-Ding;Wu Jiun Yi;Sung Ming-Chung |
| 分类号 |
H01L21/50;H01L23/498 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
coining solder balls of a bottom package, wherein top surfaces of the solder balls are flattened after the step of coining; molding the solder balls in a molding material; and exposing the top surfaces of the solder balls through trenches in the molding material. |
| 地址 |
US |
