发明名称 Resist Underlayer Film Forming Compositions For Lithography, Containing Aromatic Fused Ring-Containing Resin
摘要 <p>There is provided a resist underlayer film forming composition for lithography, which in order to prevent a resist pattern from collapsing after development in accordance with the miniaturization of the resist pattern, is applied to multilayer film process by a thin film resist, has a lower dry etching rate than resists and semiconductor substrates, and has a satisfactory etching resistance relative to a substrate to be processed in the processing of the substrate. A resist underlayer film forming composition used in lithography process by a multiplayer film, comprises a polymer containing a unit structure having an aromatic fused ring, a unit structure having a protected carboxyl group or a unit structure having an oxy ring. A method of forming a pattern by use of the resist underlayer film forming composition. A method of manufacturing a semiconductor device by utilizing the method of forming a pattern.</p>
申请公布号 KR101439295(B1) 申请公布日期 2014.09.11
申请号 KR20097013389 申请日期 2007.11.27
申请人 发明人
分类号 C08F212/32;C08F226/12;C08F232/08;G03F7/11 主分类号 C08F212/32
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