| 摘要 |
Provided is a method for manufacturing an electronic component, capable of forming a soldering layer on an underlying electrode. The method for manufacturing the electronic component includes a first process of discharging 5-element solder of a melt state not to exceed the liquid surface of PAG oil in a bath with liquefied PAG oil, a second process of supplying a precursor of the electronic component arranged on the surface of the underlying electrode to expose at least copper to the outside to PAG oil solutions, and a third process of forming a soldering layer on the underlying electrode by a contact between the underlying electrode and the 5-element solder when the precursor is located in the PAG oil solutions. [Reference numerals] (16) Control unit |
