| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which an interlayer insulating film having a low dielectric constant can be formed by low-temperature baking.SOLUTION: The photosensitive resin composition for an interlayer insulating film comprises an alkali-soluble resin (A), a photosensitive agent (B), and an organic solvent (C), wherein the alkali-soluble resin (A) comprises a copolymer having a structural unit (A1) expressed by general formula (a-1) below, a structural unit (A2) expressed by general formula (a-2) below, and an alicyclic epoxy group-containing unit (A3) in the copolymer structure. In general formula, Rand Rrepresent a hydrogen atom or a methyl group; Ra represents a hydrogen atom or an organic group having a hydroxyl group; and Rb represents a hydrocarbon group. |
