| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board device which has airtightness and can be thinned.SOLUTION: The wiring board device of one embodiment includes: a first substrate on which wiring is formed and which has a first terminal; a second substrate which has a second terminal at a position corresponding to the first terminal of the first substrate; a connector which is provided between the second substrate and the first substrate and comprises an insulating interposition plate and a vertical terminal fixed substantially perpendicularly to the interposition plate and connecting a hole of the first terminal and a hole of the second terminal; an elastic gasket provided between the connector and the first substrate; and fixing means for fixing the first substrate and the second substrate with the connector and the gasket sandwiched therebetween.</p> |
