发明名称 |
Endpoint Detection for Photolithography Mask Repair |
摘要 |
A method includes scanning a lithography mask with a repair process, and measuring back-scattered electron signals of back-scattered electrons generated from the scanning. An endpoint is determined from the back-scattered electron signals. A stop point is calculated from the endpoint. The step of scanning is stopped when the calculated stop point is reached. |
申请公布号 |
US2014255826(A1) |
申请公布日期 |
2014.09.11 |
申请号 |
US201313789876 |
申请日期 |
2013.03.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Chen Chien-Lin;Wen Chih-Wei;Lin Chung-Hung |
分类号 |
G03F1/74;H01J37/317 |
主分类号 |
G03F1/74 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
scanning a lithography mask using an electron beam to repair the lithography mask, wherein the scanning is performed in an environment comprising a process gas, and wherein the process gas reacts with the lithography mask when stimulated by the electron beam; measuring back-scattered electron signals of back-scattered electrons generated from the scanning; determining an endpoint from the back-scattered electron signals; calculating a stop point from the endpoint; and stopping the step of scanning when the stop point is reached. |
地址 |
Hsin-Chu TW |