发明名称 Endpoint Detection for Photolithography Mask Repair
摘要 A method includes scanning a lithography mask with a repair process, and measuring back-scattered electron signals of back-scattered electrons generated from the scanning. An endpoint is determined from the back-scattered electron signals. A stop point is calculated from the endpoint. The step of scanning is stopped when the calculated stop point is reached.
申请公布号 US2014255826(A1) 申请公布日期 2014.09.11
申请号 US201313789876 申请日期 2013.03.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Chen Chien-Lin;Wen Chih-Wei;Lin Chung-Hung
分类号 G03F1/74;H01J37/317 主分类号 G03F1/74
代理机构 代理人
主权项 1. A method comprising: scanning a lithography mask using an electron beam to repair the lithography mask, wherein the scanning is performed in an environment comprising a process gas, and wherein the process gas reacts with the lithography mask when stimulated by the electron beam; measuring back-scattered electron signals of back-scattered electrons generated from the scanning; determining an endpoint from the back-scattered electron signals; calculating a stop point from the endpoint; and stopping the step of scanning when the stop point is reached.
地址 Hsin-Chu TW