| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode height uniform method of a wiring board for making surface height of electrode parts being connected to or coming into contact to other components uniform in a wiring board having a wiring which is pattern-formed on a surface of a flexible insulation substrate and an insulation substrate as a minimum constitutional unit, and to provide a wiring board using the same.SOLUTION: A surface on which wiring of a wiring board is not formed is stuck to a flat reinforcement plate, and a surface on which the wiring of the wiring board is formed so that surface height of electrode parts is uniform is subjected to surface polishing. Then, the wiring board is removed from the reinforcement plate. |
