MICRO ELECTRONIC COMPONENT PACKAGE AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a micro electronic component package to be examined easier.SOLUTION: A micro electronic component package comprises a micro electronic device 62. A flexible dielectric layer 42 overlaps a first face of the micro electronic device having an interval therebetween. A periphery 86 of the flexible dielectric layer 42 extends beyond a periphery of the micro electronic device. The micro electronic component package has a plurality of conductive posts 40a-40f exposed on a surface of the flexible dielectric layer, and mutually connected to the micro electronic device electrically. One of the plurality conductive posts is arranged on the periphery of the flexible dielectric layer. A soft layer 74 is arranged between the first face of the micro electronic device and the flexible dielectric layer. The soft layer overlaps at least one of the conductive posts arranged on the periphery of the flexible dielectric layer. The package comprises a support body 84 in contact with the micro electronic device and the soft layer. The support body overlaps the periphery of the flexible dielectric layer.