| 发明名称 |
MOLDING PACKAGING MATERIAL AND MOLDED CASE |
| 摘要 |
A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component. |
| 申请公布号 |
US2014255764(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201414196593 |
申请日期 |
2014.03.04 |
| 申请人 |
SHOWA DENKO PACKAGING CO., LTD. |
发明人 |
MINAMIBORI Yuuji;KURAMOTO Tetsunobu |
| 分类号 |
B32B15/088;H01M2/02;B32B7/12 |
主分类号 |
B32B15/088 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A molding packaging material, comprising:
a biaxially stretched polyamide film layer as an outer layer; a thermoplastic resin layer as an inner layer; and a metal foil layer disposed between the both layers,wherein
as the biaxially stretched polyamide film, a biaxially stretched polyamide film in which when a fracture strength of the film is defined as “X” and a fracture strain of the film is defined as “Y”, a X/Y value is 230 MPa to 360 MPa is used. |
| 地址 |
Isehara-shi JP |
