SUBSTRATE TREATMENT METHOD, NON-TRANSITORY COMPUTER STORAGE MEDIUM AND SUBSTRATE TREATMENT SYSTEM

摘要

In the present invention, photolithography processing is performed on a substrate to form a resist pattern over the substrate, and a treatment agent is caused to enter a side surface of the resist pattern and metal is caused to infiltrate the side surface of the resist pattern via the treatment agent, the formed resist pattern has a high etching selection ratio with respect to a film to be treated on the substrate so as to suppress a so-called pattern collapse, therefore.

主权项

1. A substrate treatment method of forming a resist pattern over a substrate, the method comprising:
a resist pattern forming step of performing photolithography processing on a substrate to form a resist pattern over the substrate; and a metal treatment step of causing a treatment agent to enter a side surface of the resist pattern and causing metal to infiltrate the side surface of the resist pattern via the treatment agent.