发明名称 DEVICE ATTACHMENT WITH INFRARED IMAGING SENSOR
摘要 Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
申请公布号 US2014253735(A1) 申请公布日期 2014.09.11
申请号 US201414281883 申请日期 2014.05.19
申请人 FLIR Systems, Inc. 发明人 Fox Michael;Nussmeier Mark;Kurth Eric A.;Högasten Nicholas;Hoelter Theodore R.;Strandemar Katrin;Boulanger Pierre;Sharp Barbara;Frank Jeffrey D.;Teich Andrew C.;Dumpert Dwight;Blakeley Gerald W.
分类号 H04N5/225;H04N5/33 主分类号 H04N5/225
代理机构 代理人
主权项 1. A device attachment comprising: a housing configured to releasably attach to a user device; an infrared sensor assembly within the housing, the infrared sensor assembly configured to capture thermal infrared image data; and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device.
地址 Wilsonville OR US