发明名称 SUBMOUNT ASSEMBLY INTEGRATION
摘要 In accordance with one embodiment, an apparatus is disclosed that comprises a submount operable to integrate with a laser as a laser submount assembly; a predetermined portion of the submount configured to bond with the laser; a bonding pad positioned on the predetermined portion of the submount for integrating the laser with the submount.
申请公布号 US2014252560(A1) 申请公布日期 2014.09.11
申请号 US201313787405 申请日期 2013.03.06
申请人 SEAGATE TECHNOLOGY LLC 发明人 Zhong Lijuan;Gage Edward Charles
分类号 H01S5/022 主分类号 H01S5/022
代理机构 代理人
主权项 1. An apparatus comprising: submount operable to couple with a laser as a laser submount assembly; a predetermined portion of the submount configured to couple with the laser; a bonding pad positioned on the predetermined portion of the submount for coupling the laser with the submount.
地址 Cupertino CA US