| 发明名称 |
INSULATING STRUCTURE, A METHOD OF FORMING AN INSULATING STRUCTURE, AND A CHIP SCALE ISOLATOR INCLUDING SUCH AN INSULATING STRUCTURE |
| 摘要 |
A method of forming an insulating structure, comprising forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region. |
| 申请公布号 |
US2014252533(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201313788410 |
申请日期 |
2013.03.07 |
| 申请人 |
O'Sullivan Laurence Brendan |
发明人 |
O'Sullivan Laurence Brendan |
| 分类号 |
H01L21/762;H01L29/06 |
主分类号 |
H01L21/762 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming an insulating structure, comprising
forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region. |
| 地址 |
Limerick IE |
