| 发明名称 |
LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES |
| 摘要 |
In a wafer bonding process, one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate, the wafer's characteristics during bonding are similar to that of a thinner wafer, thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably, the slots are created consistent with the singulation/dicing pattern, so that the slots will not be present in the singulated packages, thereby retaining the structural characteristics of the full-thickness substrates. |
| 申请公布号 |
US2014252405(A1) |
申请公布日期 |
2014.09.11 |
| 申请号 |
US201214352698 |
申请日期 |
2012.10.05 |
| 申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
De Samber Marc Andre;Van Grunsven Eric Cornelis Egbertus;Egelen Roy Antoin Bastiaan |
| 分类号 |
H01L33/12 |
主分类号 |
H01L33/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a first semiconductor wafer, and a second wafer that is bonded to the first wafer via bonding surfaces on the first and second wafers, wherein, to reduce warpage of the structure, at least one of the first and second wafers is scored on a surface that is opposite to the bonding surface of the wafer with a plurality of slots. |
| 地址 |
EINDHOVEN NL |
