MULTI-CHIP PACKAGE, AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN MULTI-CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide cost-effective die-to-die interconnects.SOLUTION: A multi-chip package includes: a substrate 110 having a first side 111, an opposing second side 112, and a third side 213 that extends from the first side to the second side; a first die 120 attached to the first side of the substrate and a second die 130 attached to the first side of the substrate; and a bridge 140 adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity in the substrate or between the substrate and a die layer. The bridge may constitute an active die and may be attached to the substrate using wirebonds.