发明名称 SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To perform inspection in a state that various inspection object substrates are held by a substrate holding part.SOLUTION: The substrate inspection device includes a substrate holding part 10 having a substrate mounting plate 11 formed with a plurality of insertion holes 22a and provided with guide rollers 23a to 23d, a mounting plate nipping part 12 for nipping the substrate mounting plate 11 by a lower member 31a and an upper member 31b while allowing a movement of the substrate mounting plate 11 along a mounting surface where an inspection object substrate 100 is mounted, and a substrate nipping part 13 for nipping the inspection object substrate 100. When a probe unit 51a arranged with positioning pins 63, 63 is moved upward to the substrate holding part 10 by a moving mechanism, both the positioning pins 63, 63 come into contact with the guide rollers 23a to 23d so as to make the substrate mounting plate 11 move along the mounting surface, thereby positioning the substrate mounting plate 11 for the probe unit 51a. Thus, the insertion of each probe 62a into each insertion hole 22a is permitted.
申请公布号 JP2014167411(A) 申请公布日期 2014.09.11
申请号 JP20130038888 申请日期 2013.02.28
申请人 HIOKI EE CORP 发明人 OGAWARA TAKAHIRO;TOMOI TADASHI
分类号 G01R31/28;G01R1/04;G01R31/02;H05K3/00 主分类号 G01R31/28
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