| 摘要 |
PROBLEM TO BE SOLVED: To form an evenly thin metal plating layer of a wiring pattern of a printed-wiring board including a through-hole.SOLUTION: A via hole base hole is formed on a multilayer substrate comprised of an insulation resin, via hole plating is formed, having the via hole base hole filled with metal plating, and flatness processing is performed by removing the protrusion of the via hole plating and making the upper height of the via hole plating uniform with the surface of the multilayer substrate. A through-hole is formed on the multilayer substrate and then a through-hole plating layer is formed on a wall surface of the through-hole, a metal plating layer is formed on the surface of the multilayer substrate, and a wiring pattern is formed by etching the metal plating layer on the surface of the multilayer substrate. Thereby, a printed-wiring board is manufactured. |
