发明名称 DIFFERENTIAL CARRIER ELECTRONICS PACKAGE
摘要 A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an environment that is external to a differential carrier housing. The lower portion extends through an opening in the differential housing, thereby further being in thermal contact with a fluid within the differential housing. The package housing further has an electronic circuit that is attached to and in thermal conduction with the upper portion, within the package housing. The lower portion may have a connector portion formed in it for electrically connecting between external electrical devices and sources, the electronic circuit, and control devices within the differential housing.
申请公布号 US2014254102(A1) 申请公布日期 2014.09.11
申请号 US201414197684 申请日期 2014.03.05
申请人 Dana Automotive Systems Group, LLC 发明人 Paielli Perry M.;Creech Michael Z.
分类号 F16H61/00;F16H57/04 主分类号 F16H61/00
代理机构 代理人
主权项 1. A differential carrier electronics package comprising: a package housing comprising an upper portion having high thermally conductive properties and a lower portion having low thermally conductive properties, the upper and lower portions being sealed together; wherein, the upper portion and lower portion being in thermal contact with an environment external to a differential carrier housing and the lower portion extended through an opening in the differential carrier housing and in thermal contact with a fluid within the differential carrier housing.
地址 Maumee OH US