Film Deposition Apparatus with Low Plasma Damage and Low Processing Temperature

摘要

A deposition system includes a magnetron sputter deposition source that includes a backing frame that includes a window and a closed loop around the window. The backing frame includes inside surfaces towards the window, one or more sputtering targets mounted on inside surfaces of the backing frame, and one or more magnets mounted on outside surfaces of the backing frame. The one or more sputtering targets include sputtering surfaces that define internal walls of the window. The one or more magnets can produce a magnetic field near the one or more sputtering surfaces. A substrate includes a deposition surface oriented towards the window in the backing frame. The deposition surface receives sputtering material(s) from the one or more sputtering targets.

主权项

1. A deposition system, comprising:
a magnetron sputter deposition source comprising:
a backing frame that defines a window and a closed loop around the window, wherein the backing frame includes inside surfaces towards the window, wherein the backing frame includes outside surfaces opposite to the inside surfaces;one or more sputtering targets mounted on the inside surfaces of the backing frame, wherein the one or more sputtering targets include one or more sputtering surfaces that define internal walls of the window; andone or more magnets mounted on the outside surfaces of the backing frame, wherein the one or more magnets are configured to produce a magnetic field near the one or more sputtering surfaces, wherein the one or more sputtering targets are configured to provide sputtering material(s) from the one or more sputtering surfaces, wherein the sputtering material(s) are to be deposited on a first deposition surface on a first substrate, wherein the first deposition surface is oriented towards the window in the backing frame.