| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a module substrate, capable of preventing breakage of a component mounted on a substrate.SOLUTION: A method for producing a module substrate uses a substrate on which at least one component is mounted, a thermosetting resin sheet and a thickness adjusting jig. The thermosetting resin sheet has a first opening, and the thickness adjusting jig has a second opening. The method includes: a step (A) of overlapping the substrate and the thermosetting resin sheet with each other so that the component is contained in the first opening; and a step (B) of overlapping the thermosetting resin sheet and the thickness adjusting jig with each other so that the first opening and the second opening face each other. |
