发明名称 PACKAGING MATERIAL FOR ELECTROCHEMICAL CELL
摘要 Provided is a packaging material for an electrochemical cell which prevents the occurrence of short circuits. A packaging material for an electrochemical cell configured by laminating a base material layer including: at least a resin film; a heat-adhesive layer including a heat-adhesive resin, the heat-adhesive layer being disposed on the innermost layer; and a barrier layer including a metal foil, the barrier layer being disposed between the base material layer and the heat-adhesive layer, wherein a chemical-conversion-treated layer including alumina particles and modified epoxy resin is formed on the surface of at least the heat adhesive layer side of the barrier layer.
申请公布号 US2014255765(A1) 申请公布日期 2014.09.11
申请号 US201214352624 申请日期 2012.10.22
申请人 DAI NIPPON PRINTINGS CO., LTD. 发明人 Akita Hirohisa;Amano Makoto;Yokota Kazuhiko;Yamashita Rikiya
分类号 H01G9/08;H01M2/02;H01G11/78 主分类号 H01G9/08
代理机构 代理人
主权项 1. An electrochemical cell packaging material comprising, as layers laminated together, at least: a base material layer formed of a resin film; a thermally adhesive layer arranged as an innermost layer and formed of a thermally adhesive resin; and a barrier layer arranged between the base material layer and the thermally adhesive layer and formed of a metal foil, wherein a chemical conversion treatment layer containing alumina particles and a modified epoxy resin is formed at least on a surface of the barrier layer facing the thermally adhesive layer, and on the chemical conversion treatment layer formed on the surface of the barrier layer facing the thermally adhesive layer, an insulating layer containing a modified epoxy resin is laminated.
地址 Tokyo JP