Package Structures and Methods for Forming the Same

摘要

A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.

主权项

1. A method comprising:
providing a first substrate; forming a first dielectric layer over a first surface of the first substrate; forming a patterned sacrificial layer over the first dielectric layer, the patterned sacrificial layer having openings formed therein; forming conductive pillars in the openings of the patterned sacrificial layer; providing a second substrate over the patterned sacrificial layer; forming through vias in the second substrate; and electrically coupling one or more integrated circuit dies to the conductive pillars, the integrated circuit dies being coupled to a side of the second substrate opposite the pillars.