3D-Packages and Methods for Forming the Same

摘要

A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.

主权项

1. A package comprising:
an interposer comprising:
a first substrate free from through-vias therein;redistribution lines over the first substrate; anda first plurality of connectors over and electrically coupled to the redistribution lines; a first die over and bonded to the first plurality of connectors, wherein the first die comprises:
a second substrate; andthrough-vias in the second substrate; a second die over and bonded to the plurality of connectors, wherein the first die and the second die are electrically coupled to each other through the redistribution lines; and a second plurality of connectors over the first die and the second die, wherein the second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.