Semiconductor Device and Method of Manufacturing Thereof

摘要

A semiconductor device includes a semiconductor substrate having a first main surface in which a recess is formed. Further, the semiconductor device includes an electrical interconnect structure which is arranged at a bottom of the recess. A semiconductor chip is located in the recess. The semiconductor chip includes a plurality of chip electrodes facing the electrical interconnect structure. Further, a plurality of electrically conducting elements is arranged in the electrical interconnect structure and electrically connected to the plurality of chip electrodes.

主权项

1. A semiconductor device, comprising:
a semiconductor substrate having a first main surface which comprises a recess; an electrical interconnect structure arranged at a bottom of the recess; a semiconductor chip located in the recess, wherein the semiconductor chip comprises a plurality of chip electrodes facing the electrical interconnect structure; and a plurality of electrically conducting elements arranged in the electrical interconnect structure and electrically connected to the plurality of chip electrodes.